// Analog · Mixed-signal · Digital IC design

Divya Shree
Tala

I design circuits that hold up across process, voltage & temperature, and take digital designs from RTL to GDSII.

M.S. Electrical Engineering, Arizona State University · May 2027

Each lit die is a project · click one for its datasheet

Projects13
Process nodes7nm → 0.25µm
Fastest clock1.08GHz
PublicationIJIRT’24

01 / Selected work

Projects, each with a datasheet

02 / On the bench

Three signals, three designs

Pick a channel. Move over the screen to probe the trace.

CH1 CLK500 mV/div—
GCN ASIC · clock909 MHz
DST-SCOPE · illustrative tracesValues from simulation

03 / About

From breadboards to silicon

Stage 1BreadboardsChildhood
Stage 2BMS College2020 – 2024
Stage 3SmartDV2024 – 2025
Stage 4 · nowASU2025 – 2027

Small parts, big idea

How it started

As a kid I built small circuits by following manuals, wiring up whatever the page showed. Then I learned the same kinds of parts were inside our phones and everything else at home. A few components could let people on opposite sides of the world talk. That felt like a superpower.

Analog wasn't my favorite subject at first. Working on a real CAN transceiver at SmartDV changed that: parts I thought I understood were being used in ways I hadn't imagined.

If I knew how these things work, I could build anything I had envisioned.

Analog Design Intern

SmartDV Technologies · Bangalore · Mar 2024 – Mar 2025
  • CAN FDLed transistor-level design of the high- and low-side output drivers for an automotive transceiver: 1.5–3 V dominant differential into 50–65 Ω over −40 to 150 °C, verified with Monte Carlo.
  • +60%Led the over-temperature protection design, found the root cause, and fixed it, improving circuit efficiency by 60%.
  • TimeoutCoded the TXD dominant-timeout block (1.2–4.0 ms), sized against the CAN worst case of 11 consecutive dominant bits.
  • Wake-upCoded the standby wake-up pattern monitor that rejects bus faults, noise, and EMI so only valid CAN frames wake the node.

04 / Resume

Education & layer stack

Arizona State University

M.S. Electrical Engineering · 2025 – 2027 · GPA 3.7
  • Analog IC, Advanced Analog IC Design, Communication Transceiver Circuits
  • VLSI Design, VLSI Design and Automation, SoC for Digital Design
  • Design Verification and Testing, Advanced Digital Design and Verification

BMS College of Engineering

B.E. Electronics & Communication · 2020 – 2024
  • Analog Electronic Circuits, Linear ICs, Mixed-Signal Design, RF and Microwave
  • Published a paper on a Booth multiplier taken from RTL to GDSII

Eligible for F-1 OPT + 24-month STEM OPT extension

Analog design

  • OTAs
  • Folded-cascode
  • LDOs
  • Current references
  • Output drivers
  • Compensation
  • PSRR / CMRR
  • Monte Carlo

Digital design

  • RTL
  • Computer architecture
  • Pipelining
  • CDC
  • Synthesis
  • Place & route
  • STA
  • Coverage

EDA tools

  • Virtuoso
  • Spectre
  • ADE L/XL
  • Genus
  • Innovus
  • VCS
  • Verdi
  • Design Compiler
  • HSPICE
  • Vivado

Languages

  • SystemVerilog
  • Verilog
  • Python
  • TCL
  • C/C++

05 / Contact

Let's build circuits that hold up across PVT.

I'm looking for 2027 new-grad roles in analog, mixed-signal, and digital design. Email is the fastest way to reach me.

LinkedIn GitHub
Datasheet